Water-dispersible resin composition for use in boring hole in printed wiring board, sheet comprising the composition, and method for boring hole in printed wiring board using the sheet

ABSTRACT

The present invention provides a water-dispersant resin composition for perforating a printed wiring board excellent in preciseness of the processing position and plating throwing power when perforating, a sheet for perforating using the composition, a process for perforating a printed wiring board using the sheet. More specifically, the present invention provides a water-dispersant resin composition for perforating a printed wiring board comprising a water-soluble polymer (A) and a polymer compound (B) containing the compound represented by the following formula (1) as a copolymer component, a sheet for perforating using the composition, and a process for perforating a printed wiring board using the sheet.                  
 
(wherein, R represents hydrogen or a methyl group, and n represents an integer of 10 to 22).

CROSS-REFERENCE TO RELATED APPLICATION

This application is the U.S. National Stage of International ApplicationNumber PCT/JP02/07196 filed Jul. 16, 2002 and claiming priority fromJapanese Application No. 2001-216186 filed Jul. 17, 2001.

TECHNICAL FIELD

The present invention relates to a water-dispersant resin compositionfor perforating a printed wiring board, which is useful in perforationfor forming a through hole on a laminated plate such as a multi-layerprinted wiring board, a sheet comprising the composition and a processfor perforating a printed wiring board using the sheet.

BACKGROUND ART

In perforation for forming a through hole on a laminated substrate suchas a printed wiring board, in the case that the diameter of the hole islarge, perforation is conducted by placing a drill directly on thesubstrate. However, in the case of a general-purpose substrate with asmall-diameter hole, generally thin metal film such as aluminum foil anda layer of various water-soluble compounds are placed on the abovesubstrate and the substrate is perforated using a drill, a gimlet or apuncher.

In the above methods, the film of a water-soluble compound is used toprevent slipping of the drill-bit part caused by unevenness on thesurface of the substrate and to precisely place the tip of the drill onthe desired location for the through hole part, that is, to securepreciseness of the processing position. Furthermore, the aluminum foilis used to prevent peeling of the copper face on the substrate whenpulling out the drill after perforating the substrate, that isprevention of burn, along with problems such as clogging of the throughhole part caused by heat generated in the through hole part and adhesionof shaving scraps, which occur when perforating. By using a laminate ofthe aluminum foil/water-soluble compound film, through hole processingis conducted efficiently. Moreover, the water-soluble compound film hasthe advantage of being removable from the substrate by washing thesubstrate with water after perforating.

Described below are known documents describing the water-solublecompound used for the above purpose. For instance, (1) JP-A-4-92488 and(2) JP-A-4-92494 disclose applying polyethylene glycol or polypropyleneglycol on one face or both faces of a substrate. (3) JP-A-7-96499discloses applying a water-soluble polymer comprising a polyalkyleneoxide compound and polycarboxylic acid and/or a diisocyanate compound.(4) JP-A-10-6298 discloses applying a composition comprising thewater-soluble polymer and a metal compound.

However, the disclosed arts (1) and (2) have problems when perforatingthe through hole, such as stickiness tends to occur on the surface ofthe water-soluble compound film and preciseness of the processingposition for the through hole part decreases, especially underconditions of high water content such as a high humidity atmosphere.Also, when using the water-soluble compound as a film, the moldabilityis poor and forming into a sheet becomes difficult.

Also, there is room for improvement in the above disclosed arts (3) and(4), from the viewpoint of preciseness of the processing position whenconducting perforation continuously using a fine drill with a drilldiameter of 0.15 mm.

Furthermore, each of the disclosed arts (1)˜(4) need to be improvedfurther in plating throwing power, that is plating uniformly whenplating the interior of the through hole, which is one of the recenthigh demands regarding quality.

DISCLOSURE OF INVENTION

As a result of intensive research to solve the above problems, awater-dispersant resin composition for perforating a printed wiringboard which comprises a water-soluble polymer (A), particularly apolyvinyl alcohol resin, and a polymer compound (B) containing acompound represented by the following formula (1) as a copolymercomponent, was found to solve the problems and the present invention wasachieved.

(wherein, R represents hydrogen or a methyl group, and n represents aninteger of 10 to 22).

That is, the present invention relates to a water-dispersant resincomposition for perforating a printed wiring board comprising awater-soluble polymer (A) and a polymer compound (B) containing acompound represented by the following formula (1) as a copolymercomponent

(wherein, R represents hydrogen or a methyl group, and n represents aninteger of 10 to 22).

Preferably, 30 to 90% by weight of water-soluble polymer (A) and 10 to70% by weight of polymer compound (B) containing a compound representedby said formula (1) as a copolymer component is contained.

The water-soluble polymer (A) is preferably a polyvinyl alcohol resin.

The polyvinyl alcohol resin preferably has a hydrolyzation degree of atleast 65% by mole and a viscosity of 2.5 to 100 mPa·s at 20° C. of a 4%by weight aqueous solution.

The present invention also relates to a sheet for perforating a printedwiring board comprising the water-dispersant resin composition forperforating a printed wiring board.

The present invention also relates to a sheet for perforating a printedwiring board comprising a substrate on which the water-dispersant resincomposition for perforating a printed wiring board is laminated.

The present invention also relates to a process for perforating aprinted wiring board which comprises placing the above sheet on aprinted wiring board, and perforating the printed wiring board with adrill.

The present invention also relates to a process for perforating aprinted wiring board which comprises placing the above sheet so that thesubstrate surface thereof contacts with a printed wiring board, andperforating the printed wiring board with a drill.

BEST MODE FOR CARRYING OUT THE INVENTION

The water-dispersant resin composition for perforating the printedwiring board of the present invention is described below.

The water-dispersant resin composition of the present invention isobtained by compounding a water-soluble polymer (A) and a polymercompound (B) containing the compound represented by the above formula(1) as a copolymer component.

Examples of the water-soluble polymer (A) are polyvinyl alcohol resin,polyalkylene glycol, starch, sodium polyacrylate, cellulose derivatives,casein, sodium alginate, pectin, polyacrylamide, polyethyleneimine,polyethylene oxide and polyvinylpyrrolidone. Of these, polyvinyl alcoholresin is preferable in view of preciseness of the processing positionwhen perforating with a drill. The case in which polyvinyl alcohol resinis used is described below.

The polyvinyl alcohol resin can be either polyvinyl alcohol or modifiedpolyvinyl alcohol. The polyvinyl alcohol is prepared by homopolymerizingvinyl acetate, and then hydrolyzing. The modified polyvinyl alcohol isprepared by hydrolyzing a polymer of vinyl acetate and anotherunsaturated monomer or post-modifying polyvinyl alcohol.

Examples of the other unsaturated monomer described above are olefinssuch as ethylene, propylene, isobutylene, α-octene, α-dodecene andα-octadecene; unsaturated acids such as acrylic acid, methacrylic acid,crotonic acid, maleic acid, maleic anhydride, itaconic acid, saltthereof or mono- or dialkylester thereof; nitriles such as acrylonitrileand methacrylonitrile; amides such as acrylamide and methacrylamide;olefin sulfonic acid such as ethylene sulfonic acid, allyl sulfonicacid, methallyl sulfonic acid and salt thereof; alkyl vinyl ethers;N-acrylamide methyltrimethyl ammonium chloride; allyl trimethyl ammoniumchloride; dimethyl allyl vinyl ketone; N-vinyl pyrrolidone; vinylchloride; vinylidene chloride; polyoxyalkylene (meth)allylether such aspolyoxyethylene (meth)allylether and polyoxypropylene (meth)allylether;polyoxyalkylene (meth)acrylate such as polyoxyethylene (meth)acrylateand polyoxypropylene (meth)acrylate; polyoxyalkylene (meth)acrylamidesuch as polyoxyethylene (meth)acryamide and polyoxypropylene(meth)acrylamide; polyoxyethylene(1-(meth)acrylamide-1,1-dimethylpropyl)ester; polyoxyethylene vinylether; polyoxypropylene vinyl ether; polyoxyethylene allyl amine;polyoxypropylene allyl amine; polyoxyethylene vinyl amine andpolyoxypropylene vinyl amine. Of these, ethylene is preferable from theviewpoint of hydrolyzing with ease.

Examples of the methods for post-modifying are acetoacetic esterizing,acetalization, urethanization, etherfication, grafting, phosphateesterification and oxyalkylenization of polyvinyl alcohol.

Of the above polyvinyl alcohol resin, resin having a hydrolyzationdegree of at least 65% by mole, more preferably 70 to 100% by mole, mostpreferably 75 to 99% by mole, is preferable. A hydrolyzation degree ofless than 65% by mole is not preferable from the viewpoint that removalof polyvinyl alcohol resin by washing with water after perforating isdifficult.

The viscosity of a 4% by weight aqueous solution is preferably 2.5 to100 mPa·s at 20° C., more preferably 2.5 to 70 mPa·s, most preferably2.5 to 60 mPa·s. When the viscosity is less than 2.5 mPa·s, the strengthof the water-dispersant resin composition of the present invention whenused as a film is poor and the film may break when perforating. On theother hand, when the viscosity is more than 100 mPa·s, properties forforming into a film or sheet tend to decrease. The viscosity is measuredaccording to JIS K 6726.

Described below is the polymer compound (B) of the water-dispersantresin composition of the present invention.

The polymer compound (B) is a copolymer of the compound represented bythe following formula (1) and another compound

(wherein, R represents hydrogen or a methyl group, and n represents aninteger of 10 to 22).

In the above formula (1), n is 10 to 22, more preferably 15 to 22. Apolymer compound obtained by copolymerizing a compound in which n isless than 9 has poor moldability. On the other hand, n which is morethan 23 is unpreferable, as compatibility between the polymer compound(B) and the water-soluble polymer (A) decreases.

The examples of the compound represented by formula (1) are stearyl(meth)acrylate, pentadeca (meth)acrylate, palmitil (meth)acrylate andheptadecane (meth)acrylate. Of these, stearyl (meth)acrylate ispreferable in view crystallinility at room temperature and flowabillityof liquid at a high temperature.

The other compound to be copolymerized with the compound represented bythe above formula (1) is not particularly limited. However, an acryliccompound is preferable from the viewpoint of stability whencrystallizing. Examples are (meth)acrylic acid, methyl (meth)acrylate,ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, hexyl(meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate,benzyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, hydroxyethyl(meth)acrylate, hydoxypropyl (meth)acrylate, and glycidyl(meth)acrylate. Of these, acrylic acid is preferable from the viewpointof cleaning after perforation.

In the present invention, when preparing the polymer compound (B), thecopolymerization ratio of the compound represented by the above formula(1) and the other compound is preferably within a range of 50/50 to 95/5(weight ratio), more preferably 70/30 to 90/10. When thecopolymerization ratio is less than 50/50, plasticity may decrease whenthe composition of the present invention is left for a long time as asheet and plating throwing power may decrease when perforation isconducted using the sheet. When the copolymerization ratio is more than95/5, gel substances tend to separate out from the sheet when storingthe sheet for perforating.

Copolymerization is generally conducted by solution polymerization. Thereaction solution containing the obtained polymer compound (B) may beused in the water-dispersant resin composition as it is, but isgenerally used in the water-dispersant resin composition after adjustingthe concentration of the resin.

The weight average molecular weight of the polymer compound (B) ispreferably 1,000 to 200,000, more preferably 3,000 to 100,000. When theweight average molecular weight is less than 1,000, the compatibilitywith the water-soluble polymer (A) becomes poor. A weight averagemolecular weight of more than 200,000 is unpreferable, as the plasticitymay decrease when the perforating sheet is formed and left for a longtime.

Commercial products of the polymer compound (B) are 25 distributed as asolvent solution such as VANARESIN2203, VANARESIN2205, VANARESIN2206,and VANARESIN2207, which are solvent solutions of a copolymer of stearylmethacrylate/acrylic acid, available from Shin-Nakamura Chemical Co.,Ltd.

Regarding the compounding amount of the water-soluble polymer (A) andthe polymer compound (B) in the water-dispersant composition of thepresent invention, the compounding amount of (A) is preferably 30 to 90%by weight, more preferably 30 to 70% by weight. The compounding amountof (B) is preferably 10 to 70% by weight, more preferably 30 to 70% byweight. When the compounding amount of the water-soluble polymer (A) isless than 30% by weight or the compounding amount of the polymercompound (B) is more than 70% by weight, the dispersibility of thewater-dispersant resin composition tends to decrease. When thecompounding amount of the water-soluble polymer (A) is more than 90% byweight or the compounding amount of the polymer compound (B) is lessthan 10% by weight, the drill may be damaged when perforatingcontinuously with a drill under high humidity.

In the water-dispersant resin composition of the present invention, alubricant such as a nonionic surfactant, an antirust agent, a stabilizersuch as phosphate esters and a known additive such as metal powder andinorganic powder may be added if necessary.

When the water-dispersant resin composition of the present invention isused as a sheet for perforating a printed wiring board (hereinafter,referred to as sheet for perforating), the water-dispersant resincomposition is used as a single film or a single sheet, or a laminatedsheet of which the composition is laminated on a substrate. Of these,the laminated sheet is preferable in practical use.

The sheet for perforating of the present invention is prepared, forexample, by the following process.

First, a 5 to 20% by weight aqueous solution of the water-solublepolymer (A) is prepared. The polymer compound (B) is insoluble in water,but soluble in a solvent, and therefore the copolymer reaction solutionis used as it is, or as a solvent solution of 30 to 70% by weight bysuitably adjusting the resin concentration. Then, the aqueous solutionof the water-soluble polymer (A) and the solvent solution of the polymercompound (B) are dispersed using an agitator and the dispersant isadjusted so as to be within the range of the above compounding ratio. Asolid content hereat is preferably 10 to 40% by weight. When the solidcontent is less than 10% by weight, film thickness tends to be poor whenforming the film and when the solid content is more than 40% by weight,mixing and dispersing tend to be poor.

In order to form a single film or a single sheet using the dispersantsolution, for example, common film-forming methods such as flow casting,melt extrusion by a T-die or inflation or calender method may beemployed. The thickness of the sheet for perforating is preferablyadjusted within the range of 60 to 1,000 μm.

The moisture content of the sheet for perforating obtained by theprocess described above is preferably adjusted to 1 to 10% by weight,more preferably 1 to 7% by weight.

When the moisture content is less than 1% by weight, cracking tends tooccur when forming the sheet or the film. Moisture content of more than10% by weight is unpreferable as peeling properties of the film from amolding machine become poor. The sheet may contain a small amount of thesolvent used when copolymerizing the polymer compound (B), butpreferably the amount of the solvent is as little as possible.

When preparing a laminated sheet, the substrate is not particularlylimited. Examples of the substrate are metal foil, polyethylenetelephthalate, cellulose triacetate, polyvinyl alcohol, polystyrene, anda plastic film and a plastic sheet comprising plastic such aspolypropylene. Of these, metal foil is preferable from the viewpoint ofpreciseness of the position when perforating and preventing burn of acopper-clad laminate. Examples of the metal foil are metal foils ofaluminum, zinc or iron. The thickness of the substrate is preferably 50to 300 μm, more preferably 100 to 250 μm. When the thickness of thesubstrate is less than 50 μm, warpage caused by stress of the resin filmformed on the substrate tends to increase. When the thickness of thesubstrate is more than 300 μm, load of the drill increases and the lifespan of the drill tends to become short.

The thickness of the water-dispersant resin composition layer in thelaminated sheet is preferably adjusted within the range of 10 to 700 μm.When the thickness of the water-dispersant resin composition layer ofthe laminated sheet is less than 10 μm, the lubricating component forthe drill tends to decrease. When the thickness of the water-dispersantresin composition layer of the laminated sheet is more than 700 μm, theamount of resin (resin on the substrate, the resin of the copper-cladlaminate) which wraps around the drill tends to increase. The overallthickness of the sheet for perforating is not particularly limited, butis adjusted within the range of 60 to 1,000 μm.

The laminated sheet is prepared by laminating the water-dispersant resincomposition on a substrate such as metal foil, a plastic film and aplastic sheet. More specifically, the laminated sheet may be prepared bydissolving the water-soluble polymer (A) in water, adding the solventsolution of the polymer compound (B) thereto in order to disperse,coating the obtained dispersant on the surface of the substrate andremoving the medium at a temperature of 40° to 100° C. to form thewater-dispersant resin composition layer or by laminating the film orthe sheet prepared from the water-dispersant resin composition alone onthe substrate by thermocompression bonding or dry lamination.

The process for perforating the printed wiring board using the sheet forperforating is conducted as follows.

The printed wiring board which is used is generally a unified substrateto which metal foil such as copper and an electric insulator arelaminated. Examples are a metal foil-clad laminate such as an epoxysubstrate having metal foil on the outer layer, a multilayer laminatehaving a printed wiring circuit in the inner layer and a metal foil-cladlaminate and a metal foil-clad plastic film having a printed wiringcircuit in the inner layer.

The sheet for perforating of the present invention is placed on one faceor both faces of the substrate. Through the sheet, in a specifiedlocation of the printed wiring board, a through hole of a specified sizeis perforated with a drill or a gimlet.

When the sheet for perforating is a laminated sheet, the substratesurface of the sheet is preferably located so as to be in contact withthe surface of the printed wiring board, from the viewpoint ofincreasing preciseness of the position of perforating.

A plurality of printed wiring boards can be perforated simultaneously bylaminating the printed wiring boards. In such a case, the sheet forperforating of the present invention (a single film or single sheet ofthe water-dispersant resin composition or a laminated sheet of which thecomposition is laminated on a substrate) is preferably placed on theupper face of the topmost substrate and between each substrate.

The sheet for perforating of the present invention may be subjected toadhesion processing on the sheet surface, in order to prevent side slipof the printed wiring boards when used, or to mold release processing,before being removed by dissolving with water and after perforation, forease in peeling when separating each laminated printed wiring board.

Further, uneven patterns may be formed on the sheet surface byconducting dull finish etching and embossing to one face or both facesof the sheet in order to improve the preciseness of the processingposition. Examples of the uneven patterns are a grid pattern, a silkpattern, a hexagonal pattern and a diamond pattern. When conducting dullfinish etching, practically, the surface roughness (measured by a lasermicroscope) is adjusted to about 1 to 5 μm and uneven set is at most 200mesh and a depth of about 1 to 5 μm (measured according to JIS B 0601).

Hereinafter, the present invention is described in detail by means ofExamples, but not limited thereto.

In Examples, “%” and “part” represent the weight standard unlessdescribed otherwise.

EXAMPLE 1

11 parts of polyvinyl alcohol resin (“GOHSENOL KM-11” available from TheNippon Synthetic Chemical Industry Co., Ltd.), in which thehydrolyzation degree is 78% by mole and the viscosity of a 4% aqueoussolution is 13 mPa·s at 20° C., was dissolved in 59 parts of water. Tothe aqueous solution, 30 parts (copolymer content 16.5 parts) of atoluene/isopropanol solution (weight ratio 7/3) containing 55% of acopolymer of stearyl methacrylate/acrylic acid (copolymerization ratio85/15) having a weight average molecular weight of 20,000(“VANARESIN2206”, available from Shin-Nakamura Chemical Co., Ltd.) wasmixed while stirring and 100 parts (solid content 27.5 parts) of adispersant of the water-dispersant resin composition was obtained.

The above dispersant was coated on an aluminum foil with a thickness of100 μm using an applicator of 35 mil and a coating with a film thicknessof 160 μm was formed by drying for 96 hours at 65° C. to obtain thesheet for perforating. In the water-dispersant resin composition layerof the sheet, both toluene and isopropanol were not contained and themoisture content of the sheet was 2%.

Next, two printed wiring boards with an overall thickness of 0.4 mm, towhich a copper foil with a thickness of 18 μm is laminated on bothfaces, were laminated. The sheet for perforating was placed thereon sothat the aluminum foil surface contacts the copper surface. Then, 1000through holes which penetrate the two substrates were formed by a 0.15mm φ drill under conditions of room temperature and 30% RH. Regardingthe obtained perforated substrate, the preciseness of the processingposition and plating throwing power were evaluated as described below.

(Preciseness of the Processing Position)

The actual center of the hole was measured and the difference from thepre-determined position was measured using a digital measuring machine(“DR-555-D” made by Dainippon Screen Mfg. Co., Ltd.). The average valueof the first, five hundredth and thousandth hole of the first and secondprinted wiring boards was calculated and the standard deviation σ wasfound to calculate the value (average value +3σ). Evaluation wasconducted in the following manner.

-   ⊚:less than 15% of the drill diameter-   ∘:15% to less than 20% of the drill diameter-   Δ:20% to less than 30% of the drill diameter-   x:at least 30% of the drill diameter    (Plating Throwing Power)

To the perforating substrate, copper plating (plating bath:“COPPERGLEAM125” available from Meltex Inc.) was applied. The crosssection of the seven hundred fiftieth and thousandth hole of the firstand second substrates were studied and evaluation was conducted in thefollowing manner.

-   ∘:Copper plating was applied uniformly on all holes.-   Δ:Uniformity of copper plating on one of the holes is poor.-   x:Uniformity of copper plating on at least two holes is poor.

EXAMPLE 2

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that polyvinyl alcohol resin, in which thehydrolyzation degree is 75% by mole and the viscosity of a 4% aqueoussolution is 7 mPa·s at 20° C., was used instead of the polyvinyl alcoholresin used in Example 1.

EXAMPLE 3

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that polyvinyl alcohol resin in which thehydrolyzation degree is 88% by mole and the viscosity of a 4% aqueoussolution is 52 mPa·s at 20° C. was used instead of the polyvinyl alcoholresin used in Example 1.

EXAMPLE 4

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that polyethylene glycol having a weight averagemolecular weight of 20,000 (“PEG20000” available from Kishida ChemicalCo., Ltd.) was used instead of the polyvinyl alcohol resin used inExample 1.

EXAMPLE 5

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that a toluene/isopropanol solution (weight ratio 7/3)containing 55% of a copolymer of stearyl methacrylate/acrylic acid(copolymerization ratio 90/10) having a weight average molecular weightof 17,000 (“VANARESIN2203”, available from Shin-Nakamura Chemical Co.,Ltd.) was used instead of “VANARESIN2206” available from Shin-NakamuraChemical Co., Ltd. used in Example 1.

EXAMPLE 6

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that the compounding amount of the polyvinyl alcoholresin in Example 1 was increased to 22 parts and the resin was dissolvedin 118 parts of water.

EXAMPLE 7

The dispersant of the water-dispersant resin composition prepared inExample 1 was formed into a film by flow-casting in a rotating heateddrum made of steel which was adjusted to 93° C. and then dried untiltoluene and isopropanol were not contained therein and the moisturecontent became 4%, to obtain the sheet for perforating with a thicknessof 240 μm. The sheet was placed on the same substrate as in Example 1and evaluation was conducted in the same manner as in Example 1.

EXAMPLE 8

The sheet for perforating were prepared and evaluation was conducted inthe same manner as in Example 1, except that a substrate of polyethyleneterephthalate film with a thickness of 30 μm was used instead of thesubstrate of an aluminum foil with a thickness of 100 μm used in Example1.

COMPARATIVE EXAMPLE 1

The water-dispersant resin composition and the sheet for perforatingwere prepared and evaluation was conducted in the same manner as inExample 1, except that the aqueous solution of polyvinyl alcohol resinused in Example 1 was not compounded.

The evaluation results of Examples and Comparative Example are shown inTable 1.

TABLE 1 Preciseness of Plating Throwing Processing Position Power Ex. 1⊚ ◯ Ex. 2 ⊚ ◯ Ex. 3 ⊚ ◯ Ex. 4 ◯ ◯ Ex. 5 ⊚ ◯ Ex. 6 ⊚ ◯ Ex. 7 ⊚ ◯ Ex. 8 ⊚◯ Com. Ex. 1 ⊚ x

Industrial Applicability

The water-dispersant resin composition for perforating a printed wiringboard of the present invention comprises the water-soluble polymer (A)and the polymer compound (B) containing a specific compound as thecopolymer component. Therefore, when perforating a printed wiring boardusing the sheet obtained by molding the composition, preciseness of theprocessing position and plating throwing power when perforating areexcellent.

1. A water-dispersant resin composition for perforating a printed wiringboard comprising a water-soluble polymer (A) and a polymer compound (B)containing a compound represented by the following formula (1) as acopolymer component

wherein, R represents hydrogen or a methyl group, and n represents aninteger of 14 to
 22. 2. The water-dispersant resin composition forperforating a printed wiring board of claim 1, comprising 30 to 90% byweight of said water-soluble polymer (A) and 10 to 70% by weight of saidpolymer compound (B) containing a compound represented by said formula(1) as a copolymer component.
 3. The water-dispersant resin compositionfor perforating a printed wiring board of claim 2, wherein saidwater-soluble polymer (A) is a polyvinyl alcohol resin.
 4. Thewater-dispersant resin composition for perforating a printed wiringboard of claim 10, wherein said polyvinyl alcohol resin has ahydrolyzation degree of at least 65% by mole and a viscosity of 2.5 to100 mPa·s at 20° C. of a 4% by weight aqueous solution.
 5. Thewater-dispersant resin composition for perforating a printed wiringboard of claim 1, wherein said water-soluble polymer (A) is a polyvinylalcohol resin.
 6. The water-dispersant resin composition for perforatinga printed wiring board of claim 5, wherein said polyvinyl alcohol resinhas a hydrolyzation degree of at least 65% by mole and a viscosity of2.5 to 100 mPa·s at 20° C. of a 4% by weight aqueous solution.
 7. Asheet for perforating a printed wiring board comprising the compositionof claim
 1. 8. A process for perforating a printed wiring board whichcomprises placing the sheet of claim 7 on a printed wiring board, andperforating said printed wiring board with a drill.
 9. A sheet forperforating a printed wiring board comprising a substrate on which thecomposition of claim 1 is laminated.
 10. A process for perforating aprinted wiring board which comprises placing the substrate surface ofthe sheet of claim 9 so as to contact with a printed wiring board, andperforating said printed wiring board with a drill.
 11. A process forperforating a printed wiring board which comprises placing the sheet ofclaim 9 on a printed wiring board, and perforating said printed wiringboard with a drill.